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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-3575-11

48-3575-11

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,788 38.96

RFQ

48-3575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6570-11

48-6570-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2,482 38.96

RFQ

48-6570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6571-11

48-6571-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,049 38.96

RFQ

48-6571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6572-11

48-6572-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,799 38.96

RFQ

48-6572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6573-11

48-6573-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,847 38.96

RFQ

48-6573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6575-11

48-6575-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,838 38.96

RFQ

48-6575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6574-11

48-6574-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,649 38.96

RFQ

48-6574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3574-11

48-3574-11

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2,730 38.96

RFQ

48-3574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-93-240-17-061002

510-93-240-17-061002

SOCKET SOLDERTAIL 240-PGA

Mill-Max Manufacturing Corp.

2,703 39.08

RFQ

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-240-17-061001

510-93-240-17-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,324 39.08

RFQ

510-93-240-17-061001

Datasheet

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-240-17-061003

510-93-240-17-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,511 39.08

RFQ

510-93-240-17-061003

Datasheet

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-83-281-19-001112

614-83-281-19-001112

CONN SOCKET PGA 281POS GOLD

Preci-Dip

2,582 36.43

RFQ

614-83-281-19-001112

Datasheet

Bulk 614 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-91-289-17-000002

510-91-289-17-000002

SOCKET SOLDERTAIL 289-PGA

Mill-Max Manufacturing Corp.

3,380 39.13

RFQ

Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-289-17-000001

510-91-289-17-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,152 39.13

RFQ

510-91-289-17-000001

Datasheet

Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-289-17-000003

510-91-289-17-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,619 39.13

RFQ

510-91-289-17-000003

Datasheet

Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-241-18-075002

510-93-241-18-075002

CONN SOCKET PGA 241POS GOLD

Mill-Max Manufacturing Corp.

2,641 39.17

RFQ

510-93-241-18-075002

Datasheet

Tube 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-241-18-075001

510-93-241-18-075001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,346 39.17

RFQ

510-93-241-18-075001

Datasheet

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-241-18-075003

510-93-241-18-075003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,810 39.17

RFQ

510-93-241-18-075003

Datasheet

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-463-19-101147

546-87-463-19-101147

CONN SOCKET PGA 463POS GOLD

Preci-Dip

2,009 37.68

RFQ

546-87-463-19-101147

Datasheet

Bulk 546 Active PGA 463 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
224-7397-55-1902

224-7397-55-1902

CONN SOCKET SOIC 24POS GOLD

3M

2,618 39.37

RFQ

224-7397-55-1902

Datasheet

Bulk Textool™ Active SOIC 24 (2 x 12) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
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