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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-128-13-041002

510-13-128-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,155 38.73

RFQ

510-13-128-13-041002

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-128-13-041001

510-13-128-13-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,301 38.73

RFQ

510-13-128-13-041001

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-128-13-041003

510-13-128-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,040 38.73

RFQ

510-13-128-13-041003

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-648-G-B

APA-648-G-B

ADAPTER PLUG

Samtec Inc.

2,300 38.77

RFQ

Bulk APA Active - 48 (2 x 24) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
614-83-279-19-081112

614-83-279-19-081112

CONN SOCKET PGA 279POS GOLD

Preci-Dip

3,377 36.17

RFQ

614-83-279-19-081112

Datasheet

Bulk 614 Active PGA 279 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-93-238-19-086002

510-93-238-19-086002

PGS SOCK 238 PIN 19X19 SOLDER TL

Mill-Max Manufacturing Corp.

3,987 38.90

RFQ

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-238-19-086001

510-93-238-19-086001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,802 38.90

RFQ

510-93-238-19-086001

Datasheet

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-238-19-086003

510-93-238-19-086003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,051 38.90

RFQ

510-93-238-19-086003

Datasheet

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
48-3570-11

48-3570-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,848 38.96

RFQ

48-3570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6556-41

24-6556-41

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,085 40.70

RFQ

24-6556-41

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
514-83-357M19-001148

514-83-357M19-001148

CONN SOCKET BGA 357POS GOLD

Preci-Dip

2,883 38.26

RFQ

514-83-357M19-001148

Datasheet

Bulk 514 Active BGA 357 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
100-PGM10001-51

100-PGM10001-51

CONN SOCKET PGA GOLD

Aries Electronics

2,159 40.81

RFQ

100-PGM10001-51

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-3574-16

32-3574-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

2,146 40.82

RFQ

32-3574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
614-87-320-19-131144

614-87-320-19-131144

CONN SOCKET PGA 320POS GOLD

Preci-Dip

2,252 39.30

RFQ

614-87-320-19-131144

Datasheet

Bulk 614 Active PGA 320 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-321-19-121144

614-87-321-19-121144

CONN SOCKET PGA 321POS GOLD

Preci-Dip

2,824 39.42

RFQ

614-87-321-19-121144

Datasheet

Bulk 614 Active PGA 321 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-356M26-001152

550-10-356M26-001152

BGA SOLDER TAIL

Preci-Dip

3,362 39.37

RFQ

550-10-356M26-001152

Datasheet

Bulk 550 Active BGA 356 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-13-142-15-085001

510-13-142-15-085001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,337 41.04

RFQ

510-13-142-15-085001

Datasheet

Bulk 510 Active PGA 142 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-142-15-085002

510-13-142-15-085002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,600 41.04

RFQ

510-13-142-15-085002

Datasheet

Bulk 510 Active PGA 142 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
48-3572-11

48-3572-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2,991 38.96

RFQ

48-3572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3573-11

48-3573-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2,152 38.96

RFQ

48-3573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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