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Eight layer gold-plated board
Product parameters
Product Name: Eight layer sinking gold board
Type: Multi layer circuit board
Materials: ordinary FR4, medium Tg FR4, high Tg FR4, halogen-free board, PI material, BT material, PPO, PPE, mixed pressure, high frequency
Base copper foil thickness: outer layer 1oz; Inner layer 1/2oz
Minimum line width/spacing: 2mil/2mil
Minimum drilling diameter: 0.2mm
Minimum laser drilling aperture: 0.075mm
Blind hole depth ratio: 1:1
Maximum finished size: 500mm X600mm
Surface treatment: including lead spray tin, chemical immersion gold, immersion tin, immersion silver, full board gold plating, OSP, lead-free spray tin, hard gold plating, gold finger, mixed surface treatment
Solder mask colors: white, black, yellow, red, green, matte, blue
Special processes: high-frequency mixed pressing, back drilling, crimping holes, metal substrates, buried capacitor process, buried resistor process, etc
Detailed Introduction
High multi-layer board processing capability
Number of layers: 36
Materials: ordinary FR4, medium Tg FR4, high Tg FR4, halogen-free board, PI material, BT material, PPO, PPE, mixed pressure, high frequency (Roger Arlon\Taconic\Nelco\ Taixing Microwave F4B, Isola...),
Minimum line width/spacing: 2mil/2mil
Minimum drilling diameter: 8mil (0.20mm)
Maximum plate thickness aperture ratio: 16:1
Maximum finished product size: Maximum board size: 23 "* 32" (584mm * 812mm)
Surface treatment processes: including lead spray tin, chemical immersion gold, immersion tin, immersion silver, full board gold plating, OSP, lead-free spray tin, hard gold plating, gold finger, mixed surface treatment, etc
Solder mask colors: white, black, yellow, red, green, matte, blue
Special processes: high-frequency mixed pressing, back drilling, crimping holes, metal substrates, buried capacitor process, buried resistor process, etc
Product Name: Eight layer sinking gold board
Type: Multi layer circuit board
Materials: ordinary FR4, medium Tg FR4, high Tg FR4, halogen-free board, PI material, BT material, PPO, PPE, mixed pressure, high frequency
Base copper foil thickness: outer layer 1oz; Inner layer 1/2oz
Minimum line width/spacing: 2mil/2mil
Minimum drilling diameter: 0.2mm
Minimum laser drilling aperture: 0.075mm
Blind hole depth ratio: 1:1
Maximum finished size: 500mm X600mm
Surface treatment: including lead spray tin, chemical immersion gold, immersion tin, immersion silver, full board gold plating, OSP, lead-free spray tin, hard gold plating, gold finger, mixed surface treatment
Solder mask colors: white, black, yellow, red, green, matte, blue
Special processes: high-frequency mixed pressing, back drilling, crimping holes, metal substrates, buried capacitor process, buried resistor process, etc
Detailed Introduction
High multi-layer board processing capability
Number of layers: 36
Materials: ordinary FR4, medium Tg FR4, high Tg FR4, halogen-free board, PI material, BT material, PPO, PPE, mixed pressure, high frequency (Roger Arlon\Taconic\Nelco\ Taixing Microwave F4B, Isola...),
Minimum line width/spacing: 2mil/2mil
Minimum drilling diameter: 8mil (0.20mm)
Maximum plate thickness aperture ratio: 16:1
Maximum finished product size: Maximum board size: 23 "* 32" (584mm * 812mm)
Surface treatment processes: including lead spray tin, chemical immersion gold, immersion tin, immersion silver, full board gold plating, OSP, lead-free spray tin, hard gold plating, gold finger, mixed surface treatment, etc
Solder mask colors: white, black, yellow, red, green, matte, blue
Special processes: high-frequency mixed pressing, back drilling, crimping holes, metal substrates, buried capacitor process, buried resistor process, etc
- Help you to save your cost and time.
- Reliable package for your goods.
- Fast Reliable Delivery to save time.
- Quality premium after-sale service.
