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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-3553-16

48-3553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2,432 81.47

RFQ

48-3553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6551-16

48-6551-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2,009 81.47

RFQ

48-6551-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6552-16

48-6552-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2,751 81.47

RFQ

48-6552-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6553-16

48-6553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3,728 81.47

RFQ

48-6553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3554-16

48-3554-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2,387 81.47

RFQ

48-3554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6554-16

48-6554-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2,752 81.47

RFQ

48-6554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
234-3034-01-0602

234-3034-01-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M

2,598 81.56

RFQ

234-3034-01-0602

Datasheet

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 34 (1 x 34) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
558-10-652M35-001101

558-10-652M35-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

2,733 78.56

RFQ

558-10-652M35-001101

Datasheet

Bulk 558 Active PGA 652 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-361-18-101135

550-10-361-18-101135

PGA SOLDER TAIL

Preci-Dip

3,871 79.37

RFQ

550-10-361-18-101135

Datasheet

Bulk 550 Active PGA 361 (18 x 18) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
80-PRS15072-12

80-PRS15072-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,156 82.76

RFQ

80-PRS15072-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
191-PGM18015-10T

191-PGM18015-10T

CONN SOCKET PGA TIN

Aries Electronics

2,168 82.76

RFQ

191-PGM18015-10T

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
120-PLS13015-12

120-PLS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,370 83.29

RFQ

120-PLS13015-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
120-PRS13015-12

120-PRS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,349 83.29

RFQ

120-PRS13015-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
47-PLS16021-12

47-PLS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,632 83.41

RFQ

47-PLS16021-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
47-PRS16021-12

47-PRS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,115 83.41

RFQ

47-PRS16021-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PLS13013-12

121-PLS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,678 83.47

RFQ

121-PLS13013-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PLS13106-12

121-PLS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,043 83.47

RFQ

121-PLS13106-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PRS13013-12

121-PRS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,185 83.47

RFQ

121-PRS13013-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PRS13106-12

121-PRS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,793 83.47

RFQ

121-PRS13106-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
510-13-400-20-000001

510-13-400-20-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,411 83.68

RFQ

510-13-400-20-000001

Datasheet

Bulk 510 Active PGA 400 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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