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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
514-83-478M26-131148

514-83-478M26-131148

CONN SOCKET BGA 478POS GOLD

Preci-Dip

3,036 52.41

RFQ

514-83-478M26-131148

Datasheet

Bulk 514 Active BGA 478 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-13-225-15-000002

510-13-225-15-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,600 54.76

RFQ

510-13-225-15-000002

Datasheet

Bulk 510 Active PGA 225 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-225-15-000001

510-13-225-15-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,890 54.76

RFQ

510-13-225-15-000001

Datasheet

Bulk 510 Active PGA 225 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-225-15-000003

510-13-225-15-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,652 54.76

RFQ

510-13-225-15-000003

Datasheet

Bulk 510 Active PGA 225 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-225-18-091001

510-13-225-18-091001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,591 54.76

RFQ

510-13-225-18-091001

Datasheet

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-225-18-091002

510-13-225-18-091002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,997 54.76

RFQ

510-13-225-18-091002

Datasheet

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-225-18-091003

510-13-225-18-091003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,211 54.76

RFQ

510-13-225-18-091003

Datasheet

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-87-600M35-001148

514-87-600M35-001148

CONN SOCKET BGA 600POS GOLD

Preci-Dip

3,064 52.58

RFQ

514-87-600M35-001148

Datasheet

Bulk 514 Active BGA 600 (35 x 35) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-480M29-001148

514-83-480M29-001148

CONN SOCKET BGA 480POS GOLD

Preci-Dip

2,690 52.63

RFQ

514-83-480M29-001148

Datasheet

Bulk 514 Active BGA 480 (29 x 29) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-478M26-131152

550-10-478M26-131152

BGA SOLDER TAIL

Preci-Dip

2,256 52.86

RFQ

550-10-478M26-131152

Datasheet

Bulk 550 Active BGA 478 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
44-3573-16

44-3573-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

3,211 55.19

RFQ

44-3573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
550-10-480M29-001152

550-10-480M29-001152

BGA SOLDER TAIL

Preci-Dip

3,285 53.08

RFQ

550-10-480M29-001152

Datasheet

Bulk 550 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
36-6556-41

36-6556-41

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,793 55.34

RFQ

36-6556-41

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
121-PGM13012-10T

121-PGM13012-10T

CONN SOCKET PGA TIN

Aries Electronics

2,111 55.53

RFQ

121-PGM13012-10T

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
281-PGM18037-11

281-PGM18037-11

CONN SOCKET PGA GOLD

Aries Electronics

2,176 55.55

RFQ

281-PGM18037-11

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
558-10-456M26-001101

558-10-456M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

2,546 53.34

RFQ

558-10-456M26-001101

Datasheet

Bulk 558 Active PGA 456 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-420M26-001106

518-77-420M26-001106

CONN SOCKET PGA 420POS GOLD

Preci-Dip

2,203 53.36

RFQ

518-77-420M26-001106

Datasheet

Bulk 518 Active PGA 420 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
40-6556-40

40-6556-40

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,378 55.79

RFQ

40-6556-40

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
558-10-432M31-001104

558-10-432M31-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2,280 53.66

RFQ

558-10-432M31-001104

Datasheet

Bulk 558 Active BGA 432 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
42-6574-16

42-6574-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3,267 55.97

RFQ

42-6574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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