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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
518-77-360M19-001106

518-77-360M19-001106

CONN SOCKET PGA 360POS GOLD

Preci-Dip

2,788 44.70

RFQ

518-77-360M19-001106

Datasheet

Bulk 518 Active PGA 360 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
64-9503-21

64-9503-21

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

3,087 47.70

RFQ

64-9503-21

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
64-9503-31

64-9503-31

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

3,072 47.70

RFQ

64-9503-31

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
546-83-447-20-121147

546-83-447-20-121147

CONN SOCKET PGA 447POS GOLD

Preci-Dip

2,100 46.10

RFQ

546-83-447-20-121147

Datasheet

Bulk 546 Active PGA 447 (20 x 20) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6556-41

32-6556-41

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,284 47.98

RFQ

32-6556-41

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
514-83-420M26-001148

514-83-420M26-001148

CONN SOCKET BGA 420POS GOLD

Preci-Dip

2,120 46.05

RFQ

514-83-420M26-001148

Datasheet

Bulk 514 Active BGA 420 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-420M26-001152

550-10-420M26-001152

BGA SOLDER TAIL

Preci-Dip

2,749 46.44

RFQ

550-10-420M26-001152

Datasheet

Bulk 550 Active BGA 420 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
36-6556-40

36-6556-40

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,384 48.52

RFQ

36-6556-40

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
614-83-325-18-111144

614-83-325-18-111144

CONN SOCKET PGA 325POS GOLD

Preci-Dip

2,673 46.63

RFQ

614-83-325-18-111144

Datasheet

Bulk 614 Active PGA 325 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-400M20-000101

558-10-400M20-000101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3,214 45.73

RFQ

558-10-400M20-000101

Datasheet

Bulk 558 Active PGA 400 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
36-3570-16

36-3570-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2,052 48.83

RFQ

36-3570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
36-3571-16

36-3571-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2,618 48.83

RFQ

36-3571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
36-3572-16

36-3572-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2,932 48.83

RFQ

36-3572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
36-3573-16

36-3573-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2,807 48.83

RFQ

36-3573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
36-3574-16

36-3574-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,238 48.83

RFQ

36-3574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3575-16

36-3575-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,768 48.83

RFQ

36-3575-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6571-16

36-6571-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

3,126 48.83

RFQ

36-6571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
36-6573-16

36-6573-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,326 48.83

RFQ

36-6573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6574-16

36-6574-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,254 48.83

RFQ

36-6574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6575-16

36-6575-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,290 48.83

RFQ

36-6575-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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