Hello! now About Us
Sign InSign In
Welcome to DCZY! New customer?Start here.
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-91-628-41-001000

110-91-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,171 9.09

RFQ

110-91-628-41-001000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-306-41-001000

110-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

3,440 9.09

RFQ

110-93-306-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-306-41-001000

110-99-306-41-001000

CONN IC DIP SOCKET 6POS TIN-LEAD

Mill-Max Manufacturing Corp.

3,690 9.09

RFQ

110-99-306-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-306-41-001000

110-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,128 9.09

RFQ

110-41-306-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-314-G-M

APA-314-G-M

ADAPTER PLUG

Samtec Inc.

3,569 9.09

RFQ

Tube APA Active - 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
40-6513-11

40-6513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,464 9.11

RFQ

40-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-11

26-3513-11

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,610 9.11

RFQ

26-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-93-624-10-002000

299-93-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,659 9.12

RFQ

299-93-624-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-624-10-002000

299-43-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,466 9.12

RFQ

299-43-624-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
29-0511-10

29-0511-10

CONN SOCKET SIP 29POS TIN

Aries Electronics

3,353 9.13

RFQ

29-0511-10

Datasheet

Bulk 511 Active SIP 29 (1 x 29) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4513-11H

22-4513-11H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,369 9.13

RFQ

22-4513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3503-20

18-3503-20

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,783 9.13

RFQ

18-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3503-30

18-3503-30

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,808 9.13

RFQ

18-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-0511-10

40-0511-10

CONN SOCKET SIP 40POS TIN

Aries Electronics

3,692 9.13

RFQ

40-0511-10

Datasheet

Bulk 511 Active SIP 40 (1 x 40) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-642-41-004101

116-83-642-41-004101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,037 8.64

RFQ

116-83-642-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-150-41-013000

346-93-150-41-013000

CONN SOCKET SIP 50POS GOLD

Mill-Max Manufacturing Corp.

2,106 9.15

RFQ

346-93-150-41-013000

Datasheet

Bulk 346 Active SIP 50 (1 x 50) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-150-41-013000

346-43-150-41-013000

CONN SOCKET SIP 50POS GOLD

Mill-Max Manufacturing Corp.

3,422 9.15

RFQ

346-43-150-41-013000

Datasheet

Bulk 346 Active SIP 50 (1 x 50) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-822-90T

14-822-90T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,789 9.18

RFQ

14-822-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-6820-90TWR

18-6820-90TWR

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3,682 9.18

RFQ

18-6820-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
714-43-134-31-018000

714-43-134-31-018000

CONN SOCKET SIP 34POS GOLD

Mill-Max Manufacturing Corp.

2,044 9.19

RFQ

714-43-134-31-018000

Datasheet

Bulk 714 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 261262263264265266267268...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Help you to save your cost and time.
    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER